Routing and Alternative Uplink Module Planning for Hirschmann MSP40-00200SCY9MRHHE3AXX.X.XX MSP40 Layer 3 Advanced Industrial Ethernet Switch Base
Hirschmann MSP40-00200SCY9MRHHE3AXX.X.XX identifies Type MSP40-20-3A, part number 942076013. This MSP40 selection combines HiOS Layer 3 Advanced with a configurable Gigabit module platform. The catalog describes alternative arrangements of sixteen Gigabit plus four 2.5-Gigabit connections, or sixteen Gigabit plus two 10-Gigabit connections. Neither description means these ports are all fitted to the base or available simultaneously as one combined configuration.
Reference photograph: shared Hirschmann product image. The photographed unit may be a different model; this image does not establish the configuration or availability of Hirschmann MSP40-00200SCY9MRHHE3AXX.X.XX.
Tie routing design to the actual interface schedule
Define the routed network boundaries and required protocols, then assign them to the selected media modules. The source lists static unicast routing and OSPFv2 among its routing functions. Confirm the delivered software revision and configuration requirements with the project documentation; theoretical platform capacity is not a substitute for an approved network design.
Make the quotation identify every module
Select the required high-speed arrangement and record compatible module references, quantities and optical accessories. The standard device scope lists the backplane and power module with terminal blocks. A fully populated assembly needs a separate, explicit bill of materials. Keep that schedule with the base order so purchasing and commissioning teams review the same equipment.
Exact device selection
| Brand / range | Hirschmann / MSP modular switches |
| Type | MSP40-20-3A |
| Product code | MSP40-00200SCY9MRHHE3AXX.X.XX |
| Part number | 942076013 |
| Device format | Modular base; media modules specified separately |
| Module-dependent option A | 16 Gigabit + 4 × 2.5 Gigabit |
| Alternative option B | 16 Gigabit + 2 × 10 Gigabit |
| Software selection | HiOS Layer 3 Advanced |
| Operating Voltage | 24 V DC (18-32 ) V |
| Base consumption reference | 19.0 W; excludes media modules and PoE |
| Operating temperature | 0 to +60 °C |
| Dimensions (WxHxD) | 314 x 148 x 142 mm |
| IP Protection Rating | IP20 |
Assess the supplied assembly in its cabinet
The exact base is specified at 314 × 148 × 142 mm, IP20 and 0 to +60 °C. Its 24 V DC input accepts 18–32 V. The 19 W base consumption excludes media-module and PoE demand, so complete-system supply and thermal checks must use the chosen components and current installation guidance.
Your purchase enquiry
Request this Layer 3 reference from HKXY with quantity and destination. Include the selected uplink combination, module list, routing requirements and acceptance documents, and confirm the complete supply scope before ordering.
Technical reference: Belden catalog for MSP40-20-3A. Verify current documents and the delivered revision before final engineering approval.
